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DLPA006
DATA BUS TRANSIENT SUPPRESSOR / 3-PHASE FULL WAVE BRIDGE RECTIFIER
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Features
Mechanical Data
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Fast Switching Speed
Ultra-Small Surface Mount Package
Ideal For Three Dataline Rail Clamp or Three Phase Full Wave
Bridge Rectification
Lead Free By Design/RoHS Compliant (Note 4)
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Case: SOT-363
Case Material: Molded Plastic, "Green" Molding Compound.
UL Flammability Classification Rating 94V-0 (Note 4)
Moisture Sensitivity: Level 1 per J-STD-020D
Terminals: Finish ? Matte Tin annealed over Alloy 42
? "Green" Device (Note 5)
Data Line Transient Protection
In accordance with (Note 1):
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IEC 61000-4-2 Contact Method: ±15kV
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Leadframe. Solderable per MIL-STD-202, Method 208
Ordering Information: See Page 2
Marking Information: See Page 2
Weight: 0.006 grams (approximate)
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IEC 61000-4-2 Air Discharge Method: ±25kV
AC 3
DL 3
DC +
V CC
DC +
V CC
SOT-363
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DL 1
AC 1
GND
DC-
DL 2
AC 2
TOP VIEW
TOP VIEW
Internal Schematic
Maximum Ratings
@T A = 25°C unless otherwise specified
Characteristic
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Forward Current (Single Diode)
Non-Repetitive Peak Forward Surge Current
@ t = 1.0 μ s
Symbol
V RRM
V RWM
V R
V R(RMS)
I FM
Value
85
60
160
4.0
Unit
V
V
mA
@ t = 1.0ms
@ t = 1.0s
I FSM
1.0
0.5
A
Thermal Characteristics
Characteristic
Power Dissipation (Note 2)
Power Dissipation (Note 3)
Thermal Resistance Junction to Ambient Air (Note 2)
Thermal Resistance Junction to Ambient Air (Note 3)
Operating and Storage Temperature Range
Symbol
P D
P D
R θ JA
R θ JA
T J , T STG
Value
200
300
625
417
-65 to +150
Unit
mW
mW
° C/W
° C/W
° C
Electrical Characteristics
@T A = 25°C unless otherwise specified
Characteristic
Reverse Breakdown Voltage (Note 6)
Symbol
V (BR)R
Min
85
Typ
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Max
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Unit
V
Test Condition
I R = 100 μ A
0.90
I F = 1.0mA
Forward Voltage
V F
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1.0
1.1
V
I F = 10mA
I F = 50mA
1.25
I F = 150mA
Leakage Current (Note 6)
Total Capacitance (per element)
Capacitance Between Two Data Lines (DL 1 & DL 2 , DL 1 & DL 3 )
Capacitance Between Data Line and Ground
Reverse Recovery Time
I R
C T
C LL
C LG
t rr
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2
1.6
2.5
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5.0
80
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2.6
3.5
3.0
nA
nA
pF
pF
pF
μ s
V R = 75V
V R = 75V, T J = 150 ° C
V R = 0, f = 1.0MHz
V R = 0, f = 1.0MHz
V R = 0, f = 1.0MHz
I F = I R = 10mA,
I rr = 0.1 x I R , R L = 100 Ω
Notes:
1. Tested with V CC pins connected to GND pin.
2. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which
can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
3. Device mounted on Alumina PCB, 0.4 inch x 0.3 inch x 0.024 inch; pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which
can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
4. No purposefully added lead.
5. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
6. Short duration pulse test used to minimize self-heating.
DLPA006
Document number: DS30665 Rev. 8 - 2
1 of 4
www.diodes.com
October 2008
? Diodes Incorporated
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